NXP USA Inc. LPC2132FHN64,557

Part No.:
LPC2132FHN64,557
Manufacturer:
NXP USA Inc.
Category:
Microcontrollers
Package:
64-VFQFN Exposed Pad
Datasheet:
IC Supply HubLPC2132FHN64,557.pdf
Description:
IC MCU 16/32B 64KB FLASH 64HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:0

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Manufacturer:
NXP USA Inc.
Package/Case:
64-VFQFN Exposed Pad
Series:
LPC2100
Packaging:
Bag
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
60MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

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6. What is the process for return or replacement of LPC2132FHN64,557?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LPC2132FHN64,557 we delivered, we will accept the replacement or return of the LPC2132FHN64,557 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LPC2132FHN64,557.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations

7.How to contact us to get technical supports, such as LPC2132FHN64,557 pin diagram, LPC2132FHN64,557 datasheet?

If you need any after-sales service, please do not hesitate to contact us.

Image LPC2132FHN64/01,55 LPC2132FHN64,557
Part Number LPC2132FHN64/01,55 LPC2132FHN64,557
Manufacturer NXP USA Inc. NXP USA Inc.
Package/Case 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad
Series LPC2100 LPC2100
Packaging Tray Bag
Product Status Obsolete Obsolete
Programmable Not Verified Not Verified
Core Processor ARM7® ARM7®
Core Size 16/32-Bit 16/32-Bit
Speed 60MHz 60MHz
Connectivity I2C, Microwire, SPI, SSI, SSP, UART/USART I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 47 47
Program Memory Size 64KB (64K x 8) 64KB (64K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 16K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x10b SAR; D/A 1x10b A/D 8x10b SAR; D/A 1x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Grade - -
Qualification - -
Mounting Type Surface Mount Surface Mount
Supplier Device Package
  • LPC2132FHN64,557
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  • LPC2132FHN64,557 Datasheet
  • LPC2132FHN64,557 Specifications
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  • NXP USA Inc.
  • NXP USA Inc. LPC2132FHN64,557
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